The Snapdragon Digital Chassis Concept Vehicle embodies Qualcomm’s objectives to remain at the forefront of the future’s next-generation driving experience (and also that of auto-making in general). It entails increasingly prevalent car-wide processors that integrate hardware, software, and services, a prominent “pillar” of which are the computing solutions presented as Snapdragon Ride Platforms at CES 2023.
Qualcomm has announced that the next generation of these Platforms will be based on an advanced 4 nanometer (nm) process and will be pitched to tier-1 automakers as practically all-in-one platforms that implement “the industry’s only scalable and open system designed for ADAS and ADLotus Eletre SUV price range and specs detailed with first ‘end-to-end autonomous driving’ LiDAR kit”.
At the major trade show, the OEM also unveiled Snapdragon Ride Flex SoCs, a new automotive computing platform that, like the rest of the Snapdragon Ride Platform family, integrates the NCAP-approved and European General Safety Regulations-certified Ride Vision stack for sensor control required for next-generation self-driving capabilities.
Flex SoCs will also have a software suite that includes a real-time OS and Qualcomm’s Automotive Open System Architecture (AUTOSAR) for applications such as a car’s hypervisor and infotainment screens.
They are also qualified to provide services like parking assistance and driving monitoring. As a result, Qualcomm now promotes its future Ride Flex chips as a multi-priority “Qualcomm completes NUVIA acquisition, will release high-performance ultrabook processors in 2022digital cockpit, ADAS and AD…on a single SoC”. Their first version is now being tested by vehicle OEMs, with mass production set to commence in 2024.
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